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Single Phase Immersion Cooling

LiquidStack advanced flow technology optimizes heat transfer and rejection by directing fluid into the chassis to cool servers equipped with the latest high TDP chips. Its improved energy efficiency and additional fluid distribution throughout the unit enhance cooling effectiveness.

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Benefits At-a-Glance

  • Up to 110kW+ cooling capacity*

  • Designed for chip TDPs up to 800~1000W

  • Advanced Flow Technology to achieve >2.8kW/U

  • Fits between 4 standard (600mm) IT rack spaces

  • Supports EIA or ORV3 server standards

  • As low as 1.03 pPUE energy efficiency

  • Available for Pre-Order

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