Data Centers that make sense
What is possible implementation of immersion cooling? Companies are using this technology in variety of use cases. It is used for green/brown field designs of Data Canters and Edge compute. Our vendor partner manufactures product lines starting from small footprint MicroPOD, SmartPOD EVO to newly announced SmartPOD EXO - Setting new standards in performance, our immersion cooling solution ensures your datacenter is future-proof and climate-resilient..
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Submer understands that datacenter and IT industry is always evolving, changing and developing. The challenges that the industry faces need innovative solutions and that’s where Submer Labs comes in. Working with top Silicon and Chemical companies to developing high performance fluids and heat sinks that can handle next generation power hungry devices.
Intel and Submer Illuminate the Path to Immersion Cooling for 1000W TDP
Intel and Submer Solutions Reach Momentous Heat Dissipation
Intel and Submer’s robust technological collaboration aimed at establishing a formidable foundation for single-phase immersion technology has achieved a groundbreaking advancement in the form of the Forced Convection Heat Sink (FCHS) package. Set to revolutionize datacenter cooling, the FCHS reduces the quantity and cost of components required for comprehensive heat capture and the dissipation of chips with Thermal Design Power (TDP) exceeding 1000W.
SmartPod EXO: Transform Challenges to Opportunities
Get to know our SmartPod EXO for single-phase immersion cooling solution and how it tackles the datacenter industry challenges of today.
Submer Products
MicroPOD 6U 7kW
SmartPOD EVO up to 140kW
